Magnetic memory devices having a first magnetic pattern and multiple second magnetic patterns thereon

ABSTRACT

Disclosed is a magnetic memory device including a first magnetic pattern that extends in a first direction and has a magnetization direction fixed in one direction, and a plurality of second magnetic patterns that extend across the first magnetic pattern. The second magnetic patterns extend in a second direction intersecting the first direction and are spaced apart from each other in the first direction. Each of the second magnetic patterns includes a plurality of magnetic domains that are spaced apart from each other in the second direction.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional application claims priority under 35 U.S.C §119 to Korean Patent Application No. 10-2019-0097278, filed on Aug. 9,2019, in the Korean Intellectual Property Office, the disclosure ofwhich is hereby incorporated by reference in its entirety.

BACKGROUND

The present disclosure relates to magnetic memory devices and, moreparticularly, to magnetic memory devices that use motion of magneticdomain walls. As electronic devices trend toward higher speed and lowerpower consumption, high-speed read/write operations and low operatingvoltages may also be required for memory devices incorporated therein.To meet these requirements, magnetic memory devices have been developedas memory devices. Since the magnetic memory device operates at highspeed and has nonvolatile characteristics, it has attracted considerableattention as a next-generation memory device. In particular, newmagnetic memory devices have recently been studied and developed to usemotion of magnetic domain walls in magnetic materials.

SUMMARY

Some example embodiments of the present inventive concepts provide amagnetic memory device that can be highly integrated.

Some example embodiments of the present inventive concepts provide amagnetic memory device that can be easily mass-fabricated.

According to some example embodiments of the present inventive concepts,a magnetic memory device may comprise: a first magnetic pattern thatextends in a first direction and has a magnetization direction fixed inone direction; and a plurality of second magnetic patterns that extendacross the first magnetic pattern. The plurality of second magneticpatterns may extend in a second direction intersecting the firstdirection and may be spaced apart from each other in the firstdirection. Each of the plurality of second magnetic patterns may includea plurality of magnetic domains that are spaced apart from each other inthe second direction.

According to some example embodiments of the present inventive concepts,a magnetic memory device may comprise: a conductive line that extends ina first direction on a substrate; a first magnetic pattern that is onthe conductive line and extends in the first direction; and a pluralityof second magnetic patterns that are on the first magnetic pattern andextend across the first magnetic pattern. The plurality of secondmagnetic patterns may extend in a second direction intersecting thefirst direction and may be spaced apart from each other in the firstdirection. Each of the plurality of second magnetic patterns may includea plurality of magnetic domains that are spaced apart from each other inthe second direction.

According to some example embodiments of the present inventive concepts,a magnetic memory device may comprise: a first magnetic pattern; and aplurality of second magnetic patterns that extend across the firstmagnetic pattern. Each of the plurality of second magnetic patterns mayinclude a plurality of magnetic domains that are spaced apart from eachother in one direction. The first magnetic pattern may be electricallyconnected to each of the plurality of second magnetic patterns.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a simplified perspective view showing a magneticmemory device according to some example embodiments of the presentinventive concepts.

FIG. 2 illustrates a plan view showing a magnetic memory deviceaccording to some example embodiments of the present inventive concepts.

FIG. 3A illustrates a cross-sectional view taken along line A-A′ of FIG.2.

FIG. 3B illustrates a cross-sectional view taken along line B-B′ of FIG.2.

FIGS. 3C and 3D illustrate enlarged views showing section P of FIG. 3A.

FIGS. 4A, 4B, 5A, and 5B illustrate conceptual views showing a readoperation of a magnetic memory device according to some exampleembodiments of the present inventive concepts.

FIGS. 6A, 6B, 7A, and 7B illustrate conceptual views showing a writeoperation of a magnetic memory device according to some exampleembodiments of the present inventive concepts.

FIGS. 8A to 10B illustrate cross-sectional views showing a method offabricating a magnetic memory device according to some exampleembodiments of the present inventive concepts.

FIG. 11 illustrates a simplified perspective view showing a magneticmemory device according to some example embodiments of the presentinventive concepts.

FIG. 12 illustrates a plan view showing a magnetic memory deviceaccording to some example embodiments of the present inventive concepts.

FIG. 13A illustrates a cross-sectional view taken along line A-A′ ofFIG. 12.

FIG. 13B illustrates a cross-sectional view taken along line B-B′ ofFIG. 12.

FIGS. 14A and 14B illustrate conceptual views showing a read operationof a magnetic memory device according to some example embodiments of thepresent inventive concepts.

FIGS. 15A and 15B illustrate conceptual views showing a write operationof a magnetic memory device according to some example embodiments of thepresent inventive concepts.

FIGS. 16A to 18B illustrate cross-sectional views showing a method offabricating a magnetic memory device according to some exampleembodiments of the present inventive concepts.

FIG. 19 illustrates a simplified perspective view showing a magneticmemory device according to some example embodiments of the presentinventive concepts.

FIG. 20 illustrates a plan view showing a magnetic memory deviceaccording to some example embodiments of the present inventive concepts.

FIG. 21A illustrates a cross-sectional view taken along line A-A′ ofFIG. 20.

FIG. 21B illustrates a cross-sectional view taken along line B-B′ ofFIG. 20.

FIGS. 22A and 22B illustrate conceptual views showing a read operationof a magnetic memory device according to some example embodiments of thepresent inventive concepts.

FIGS. 23A and 23B illustrate conceptual views showing a write operationof a magnetic memory device according to some example embodiments of thepresent inventive concepts.

DETAILED DESCRIPTION

The following will now describe in detail some example embodiments ofthe present inventive concepts with reference to the accompanyingdrawings.

FIG. 1 illustrates a simplified perspective view showing a magneticmemory device according to some example embodiments of the presentinventive concepts.

Referring to FIG. 1, a conductive line 110 may extend (i.e., extendprimarily/longitudinally) in a first direction D1. The conductive line110 may be provided thereon with a first magnetic pattern 120 thatextends in the first direction D1. A plurality of second magneticpatterns 150 may be disposed on the first magnetic pattern 120, whilerunning (i.e., extending) across the first magnetic pattern 120. Theplurality of second magnetic patterns 150 may extend in a seconddirection D2 intersecting (e.g., perpendicular to) the first directionD1 and may be spaced apart from each other along the first direction D1.The plurality of second magnetic patterns 150 may be spaced apart fromthe conductive line 110 along a third direction D3 perpendicular to thefirst and second directions D1 and D2. The first magnetic pattern 120may be disposed between the conductive line 110 and the plurality ofsecond magnetic patterns 150. The first magnetic pattern 120 and theconductive line 110 may extend parallel to each other along the firstdirection D1 and may run across the plurality of second magneticpatterns 150.

A plurality of tunnel barrier patterns 140 may be interposed between thefirst magnetic pattern 120 and the plurality of second magnetic patterns150. The plurality of tunnel barrier patterns 140 may extend in thesecond direction D2 and may be spaced apart from each other along thefirst direction D1. Each of the plurality of tunnel barrier patterns 140may be interposed between the first magnetic pattern 120 and acorresponding (i.e., respective) one of the plurality of second magneticpatterns 150.

FIG. 2 illustrates a plan view showing a magnetic memory deviceaccording to some example embodiments of the present inventive concepts.FIG. 3A illustrates a cross-sectional view taken along line A-A′ of FIG.2. FIG. 3B illustrates a cross-sectional view taken along line B-B′ ofFIG. 2. FIGS. 3C and 3D illustrate enlarged views showing section P ofFIG. 3A.

Referring to FIGS. 2, 3A, and 3B, a substrate 100 may be providedthereon with a conductive line 110 that extends in a first direction D1parallel to a top surface 100U of the substrate 100. The conductive line110 may include one or more of metal (e.g., copper, tungsten, oraluminum) and metal nitride (e.g., tantalum nitride, titanium nitride,or tungsten nitride).

A first magnetic pattern 120 may extend in the first direction D1 on theconductive line 110. The conductive line 110 may be disposed between thesubstrate 100 and the first magnetic pattern 120. The first magneticpattern 120 and the conductive line 110 may extend parallel to eachother along the first direction D1. The first magnetic pattern 120 mayinclude one or more of cobalt (Co), iron (Fe), and nickel (Ni).

An interlayer dielectric layer 135 may be disposed on the substrate 100,on (e.g., covering) the conductive line 110 and the first magneticpattern 120. The interlayer dielectric layer 135 may cover a lateralsurface of the conductive line 110 and a lateral surface of the firstmagnetic pattern 120. The first magnetic pattern 120 may have a topsurface substantially coplanar with that of the interlayer dielectriclayer 135. The interlayer dielectric layer 135 may include, for example,one or more of silicon oxide, silicon nitride, and silicon oxynitride.

The interlayer dielectric layer 135 may be provided thereon with aplurality of second magnetic patterns 150 that run across the firstmagnetic pattern 120. The plurality of second magnetic patterns 150 mayextend in a second direction D2 intersecting the first direction D1 andmay be spaced apart from each other along the first direction D1. Thefirst and second directions D1 and D2 may be parallel to the top surface100U of the substrate 100. The plurality of second magnetic patterns 150may be spaced apart from the conductive line 110 along a third directionD3 perpendicular to the top surface 100U of the substrate 100, and thefirst magnetic pattern 120 may be disposed between the conductive line110 and the plurality of second magnetic patterns 150. The firstmagnetic pattern 120 may vertically overlap the conductive line 110along the third direction D3 and may extend parallel to the conductiveline 110 along the first direction D1. The first magnetic pattern 120and the conductive line 110 may run across the plurality of secondmagnetic patterns 150.

Each of the plurality of second magnetic patterns 150 may include aplurality of magnetic domains D and a plurality of magnetic domain wallsDW. In each of the plurality of second magnetic patterns 150, theplurality of magnetic domains D and the plurality of magnetic domainwalls DW may be arranged alternately and repeatedly along the seconddirection D2. The magnetic domains D may be regions in whichmagnetization directions are uniform in a magnetic substance (e.g., ineach of the second magnetic patterns 150), and the plurality of magneticdomain walls DW may be regions where magnetization directions arechanged between the plurality of magnetic domains D in the magneticsubstance. Each of the plurality of magnetic domain walls DW may definea boundary between the magnetic domains D that have differentmagnetization directions. Sizes and magnetization directions of themagnetic domains D may be appropriately controlled by external energyand a shape and size of the magnetic substance. The magnetic domainwalls DW may move by current or magnetic field applied to the magneticsubstance. Each of the plurality of second magnetic patterns 150 mayinclude one or more of cobalt (Co), iron (Fe), and nickel (Ni).

A plurality of tunnel barrier patterns 140 may be interposed between thefirst magnetic pattern 120 and the plurality of second magnetic patterns150. The plurality of tunnel barrier patterns 140 may extend in thesecond direction D2 and may be spaced apart from each other along thefirst direction D1. Each of the plurality of tunnel barrier patterns 140may be interposed between the first magnetic pattern 120 and acorresponding one of the plurality of second magnetic patterns 150, andmay extend between the corresponding second magnetic pattern 150 and theinterlayer dielectric layer 135. Each of the plurality of tunnel barrierpatterns 140 may include one or more of a magnesium (Mg) oxide layer, atitanium (Ti) oxide layer, an aluminum (Al) oxide layer, amagnesium-zinc (Mg-Zn) oxide layer, and a magnesium-boron (Mg-B) oxidelayer.

Referring to FIGS. 3C and 3D, the first magnetic pattern 120 may be areference layer whose magnetization direction 120MD is fixed in onedirection, and each of the second magnetic patterns 150 may be a freelayer whose magnetization direction 150MD is switchable. Each of themagnetic domains D may have the magnetization direction 150MD capable ofbeing oriented parallel or antiparallel to the magnetization direction120MD of the first magnetic pattern 120. For example, as shown in FIG.3C, the magnetization direction 120MD of the first magnetic pattern 120and the magnetization direction 150MD of each of the magnetic domains Dmay be perpendicular to an interface between the first magnetic pattern120 and each of the tunnel barrier patterns 140. In this case, each ofthe first and second magnetic patterns 120 and 150 may include one ormore of a perpendicular magnetic material (e.g., CoFeTb, CoFeGd, orCoFeDy), a perpendicular magnetic material having an L10 structure, CoPtof a hexagonal close packed (HCP) lattice structure, and a perpendicularmagnetization structure. The perpendicular magnetic material having theL10 structure may include one or more of FePt of the L10 structure, FePdof the L10 structure, CoPd of the L10 structure, and CoPt of the L10structure. The perpendicular magnetization structure may includemagnetic layers and non-magnetic layers that are alternately andrepeatedly stacked. For example, the perpendicular magnetizationstructure may include one or more of (Co/Pt)n, (CoFe/Pt)n, (CoFe/Pd)n,(Co/Pd)n, (Co/Ni)n, (CoNi/Pt)n, (CoCr/Pt)n, and (CoCr/Pd)n (where, n isthe stack number). For another example, as shown in FIG. 3D, themagnetization direction 120MD of the first magnetic pattern 120 and themagnetization direction 150MD of each of the magnetic domains D may beparallel to an interface between the first magnetic pattern 120 and eachof the tunnel barrier patterns 140. In this case, each of the first andsecond magnetic patterns 120 and 150 may include a ferromagneticmaterial, and the first magnetic pattern 120 may further include ananti-ferromagnetic material that fixes a magnetization direction of theferromagnetic material.

Referring back to FIGS. 2, 3A, and 3B, the first magnetic pattern 120may extend in the first direction D1 and may be connected in common to(e.g., electrically connected to each of) the plurality of secondmagnetic patterns 150. The first magnetic pattern 120 may extend from afirst location between the conductive line 110 and one of the pluralityof second magnetic patterns 150 toward (and/or to) a second locationbetween the conductive line 110 and another of the plurality of secondmagnetic patterns 150.

FIGS. 4A, 4B, 5A, and 5B illustrate conceptual views showing a readoperation of a magnetic memory device according to some exampleembodiments of the present inventive concepts. FIGS. 4A and 5Aillustrate cross-sectional views taken along line A-A′ of FIG. 2. FIGS.4B and 5B illustrate cross-sectional views taken along line B-B′ of FIG.2. For brevity of description, an example case is explained in which themagnetization directions 120MD and 150MD are perpendicular to aninterface between the first magnetic pattern 120 and each of the tunnelbarrier patterns 140, but the present inventive concepts are not limitedthereto. Even when the magnetization directions 120MD and 150MD areparallel to the interface between the first magnetic pattern 120 andeach of the tunnel barrier patterns 140, a magnetic memory device mayperform a read operation as follows.

Referring to FIGS. 2, 4A, and 4B, a current Ito move the magnetic domainwalls DW may flow through one of the plurality of second magneticpatterns 150. The rest of the plurality of second magnetic patterns 150may be held in an electrical floating state F. A direction of thecurrent I may determine moving directions of the magnetic domain wallsDW in the one of the plurality of second magnetic patterns 150. Themagnetic domain walls DW may move along a moving direction of electronsE, and thus the magnetic domain walls DW may move in a directionopposite to that of the current I. For example, the current I may flowin the second direction D2, but the magnetic domain walls DW may move ina direction opposite to the second direction D2.

In the one of the plurality of second magnetic patterns 150, themagnetization direction 150MD of each of the magnetic domains D may beparallel or antiparallel to the magnetization direction 120MD of thefirst magnetic pattern 120. The magnetic domains D may include a firstmagnetic domain Da and a second magnetic domain Db that neighbor eachother across a corresponding one of the magnetic domain walls DW. Themagnetization direction 150MD of the first magnetic domain Da may beopposite to the magnetization direction 150MD of the second magneticdomain Db. When the current I flows through the one of the plurality ofsecond magnetic patterns 150, the motion of the magnetic domain walls DWmay allow the first magnetic domain Da to align with the first magneticpattern 120. The first magnetic pattern 120 and the first magneticdomain Da may constitute a first magnetic tunnel junction MTJ1.

A read current Tread may flow through the first magnetic tunnel junctionMTJ1. The read current Tread may flow from the first magnetic pattern120 toward the first magnetic domain Da along a direction (e.g., thethird direction D3) perpendicular to an interface between the firstmagnetic pattern 120 and a corresponding one of the plurality of tunnelbarrier patterns 140. The read current Tread may detect a resistancestate of the first magnetic tunnel junction MTJ1. The read current Treadmay detect whether the first magnetic tunnel junction MTJ1 is either ina high-resistance state or in a low-resistance state. For example, themagnetization direction 150MD of the first magnetic domain Da may beparallel to the magnetization direction 120MD of the first magneticpattern 120 and, in this case, the first magnetic tunnel junction MTJ1may be in a low-resistance state. A data (e.g., a logic state of 0 or 1)stored in the first magnetic domain Da may be detected from theresistance state of the first magnetic tunnel junction MTJ1.

Thereafter, referring to FIGS. 2, 5A, and 5B, the current I may flowagain through the one of the plurality of second magnetic patterns 150.The rest of the plurality of second magnetic patterns 150 may be held inan electrical floating state F. When the current I flows through the oneof the plurality of second magnetic patterns 150, the motion of themagnetic domain walls DW may allow the second magnetic domain Db toalign with the first magnetic pattern 120. The first magnetic pattern120 and the second magnetic domain Db may constitute a second magnetictunnel junction MTJ2.

The read current Tread may flow through the second magnetic tunneljunction MTJ2. The read current Tread may flow from the first magneticpattern 120 toward the second magnetic domain Db along a direction(e.g., the third direction D3) perpendicular to an interface between thefirst magnetic pattern 120 and a corresponding one of the plurality oftunnel barrier patterns 140. The read current Tread may detect aresistance state of the second magnetic tunnel junction MTJ2. The readcurrent Tread may detect whether the second magnetic tunnel junctionMTJ2 is either in a high-resistance state or in a low-resistance state.For example, the magnetization direction 150MD of the second magneticdomain Db may be antiparallel to the magnetization direction 120MD ofthe first magnetic pattern 120 and, in this case, the second magnetictunnel junction MTJ2 may be in a high-resistance state. A data (e.g., alogic state of 1 or 0) stored in the second magnetic domain Db may bedetected from the resistance state of the second magnetic tunneljunction MTJ2.

According to some embodiments of the present inventive concepts, thefirst magnetic pattern 120 may run across the plurality of secondmagnetic patterns 150 and also may be connected in common to theplurality of second magnetic patterns 150. In this case, the readoperation mentioned above may be sequentially and individually performedon the plurality of second magnetic patterns 150.

FIGS. 6A, 6B, 7A, and 7B illustrate conceptual views showing a writeoperation of a magnetic memory device according to some exampleembodiments of the present inventive concepts. FIGS. 6A and 7Aillustrate cross-sectional views taken along line A-A′ of FIG. 2. FIGS.6B and 7B illustrate cross-sectional views taken along line B-B′ of FIG.2. For brevity of description, an example case will be explained belowwhere the magnetization directions 120MD and 150MD are perpendicular toan interface between the first magnetic pattern 120 and each of thetunnel barrier patterns 140, but the present inventive concepts are notlimited thereto. Even when the magnetization directions 120MD and 150MDare parallel to an interface between the first magnetic pattern 120 andeach of the tunnel barrier patterns 140, a magnetic memory device mayperform a write operation as follows.

Referring to FIGS. 2, 6A, and 6B, the current Ito move the magneticdomain walls DW may flow through one of the plurality of second magneticpatterns 150. The rest of the plurality of second magnetic patterns 150may be held in an electrical floating state F. For example, the currentI may flow in the second direction D2, and the magnetic domain walls DWmay move in a direction (e.g., a moving direction of electrons E)opposite to the second direction D2. When the current I flows throughthe one of the plurality of second magnetic patterns 150, the motion ofthe magnetic domain walls DW may allow the first magnetic domain Da toalign with the first magnetic pattern 120. The first magnetic pattern120 and the first magnetic domain Da may constitute the first magnetictunnel junction MTJ1. For example, the magnetization direction 150MD ofthe first magnetic domain Da may be parallel to the magnetizationdirection 120MD of the first magnetic pattern 120.

A write current Isw may flow through the first magnetic tunnel junctionMTJ1. The write current Isw may flow from the first magnetic pattern 120toward the first magnetic domain Da along a direction (e.g., the thirddirection D3) perpendicular to an interface between the first magneticpattern 120 and a corresponding one of the plurality of tunnel barrierpatterns 140. The write current Isw may have a magnitude greater thanthat of the read current Tread. The magnetization direction 150MD of thefirst magnetic domain Da may be reversed by spin transfer torque causedby the write current Isw. For example, owing to the spin transfer torquecaused by the write current Isw, the magnetization direction 150MD ofthe first magnetic domain Da may be switched antiparallel to themagnetization direction 120MD of the first magnetic pattern 120.

Thereafter, referring to FIGS. 2, 7A, and 7B, the current I may flowagain through the one of the plurality of second magnetic patterns 150.The rest of the plurality of second magnetic patterns 150 may be held inan electrical floating state F. When the current I flows through the oneof the plurality of second magnetic patterns 150, the motion of themagnetic domain walls DW may allow the second magnetic domain Db toalign with the first magnetic pattern 120. The first magnetic pattern120 and the second magnetic domain Db may constitute the second magnetictunnel junction MTJ2. For example, the magnetization direction 150MD ofthe second magnetic domain Db may be antiparallel to the magnetizationdirection 120MD of the first magnetic pattern 120.

The write current Isw may flow through the second magnetic tunneljunction MTJ2. The write current Isw may flow from the second magneticdomain Db toward the first magnetic pattern 120 along a direction (e.g.,a direction opposite to the third direction D3) perpendicular to aninterface between the first magnetic pattern 120 and a corresponding oneof the plurality of tunnel barrier patterns 140. The magnetizationdirection 150MD of the second magnetic domain Db may be reversed by spintransfer torque caused by the write current Isw. For example, owing tothe spin transfer torque caused by the write current Isw, themagnetization direction 150MD of the second magnetic domain Db may beswitched parallel to the magnetization direction 120MD of the firstmagnetic pattern 120.

According to some embodiments of the present inventive concepts, thefirst magnetic pattern 120 may run across the plurality of secondmagnetic patterns 150 and also may be connected in common to theplurality of second magnetic patterns 150. In this case, the writeoperation mentioned above may be sequentially and individually performedon the plurality of second magnetic patterns 150.

FIGS. 8A to 10B illustrate cross-sectional views showing a method offabricating a magnetic memory device according to some exampleembodiments of the present inventive concepts. FIGS. 8A, 9A, and 10Aillustrate cross-sectional views taken along line A-A′ of FIG. 2. FIG.8B, 9B, and 10B illustrate cross-sectional views taken along line B-B′of FIG. 2. Omission(s) may be made to avoid duplicate explanation of themagnetic memory device discussed above with reference to FIGS. 2 and 3Ato 3D.

Referring to FIGS. 2, 8A, and 8B, a conductive layer 110L and a firstmagnetic layer 120L may be sequentially formed on a substrate 100. Theconductive layer 110L may be interposed between the substrate 100 andthe first magnetic layer 120L. The conductive layer 110L and the firstmagnetic layer 120L may be formed by using chemical vapor deposition orphysical vapor deposition (e.g., sputtering deposition). A first maskpattern M1 may be formed on the first magnetic layer 120L. The firstmask pattern M1 may have a linear shape extending in a first directionD1. The first mask pattern M1 may include a material having an etchselectivity with respect to the conductive layer 110L and the firstmagnetic layer 120L.

Referring to FIGS. 2, 9A, and 9B, a first etching process may beperformed in which the first mask pattern M1 is used as an etching maskto etch the first magnetic layer 120L and the conductive layer 110L. Thefirst etching process may be performed such that the first magneticlayer 120L and the conductive layer 110L may be sequentially etched toform a first magnetic pattern 120 and a conductive line 110. The firstmagnetic pattern 120 and the conductive line 110 may be formed by usinga single photomask that defines the first mask pattern Ml, as a result,the first magnetic pattern 120 and the conductive line 110 may havesubstantially the same planar shape. For example, the first magneticpattern 120 and the conductive line 110 may each have a linear shapeextending in the first direction D1.

An interlayer dielectric layer 135 may be formed on the substrate 100,thereby covering sidewalls of the first magnetic pattern 120 and theconductive line 110. The formation of the interlayer dielectric layer135 may include, for example, forming on the substrate 100 a dielectriclayer that covers the first magnetic pattern 120 and the conductive line110, and performing on the dielectric layer a planarization process toexpose a top surface of the first magnetic pattern 120. In someembodiments, the first mask pattern M1 may be removed during theplanarization process.

Referring to FIGS. 2, 10A, and 10B, a tunnel barrier layer 140L and asecond magnetic layer 150L may be sequentially formed on the interlayerdielectric layer 135, thereby covering the top surface of the firstmagnetic pattern 120. The tunnel barrier layer 140L may be interposedbetween the interlayer dielectric layer 135 and the second magneticlayer 150L, and may extend between the second magnetic layer 150L andthe top surface of the first magnetic pattern 120. The tunnel barrierlayer 140L and the second magnetic layer 150L may be formed by usingchemical vapor deposition or physical vapor deposition (e.g., sputteringdeposition). The second magnetic layer 150L may include a plurality ofmagnetic domains D and a plurality of magnetic domain walls DW.

Second mask patterns M2 may be formed on the second magnetic layer 150L.Each of the second mask patterns M2 may have a linear shape extending ina second direction D2. The second mask patterns M2 may be spaced apartfrom each other along the first direction D1. The second mask patternsM2 may include a material having an etch selectivity with respect to thetunnel barrier layer 140L and the second magnetic layer 150L.

Referring back to FIGS. 2, 3A, and 3B, a second etching process may beperformed in which the second mask patterns M2 are used as an etchingmask to etch the second magnetic layer 150L and the tunnel barrier layer140L. The second etching process may be performed such that the secondmagnetic layer 150L and the tunnel barrier layer 140L may besequentially etched to form second magnetic patterns 150 and tunnelbarrier patterns 140. The second magnetic patterns 150 may run acrossthe first magnetic pattern 120 and the conductive line 110, and mayextend along the second direction D2 onto the interlayer dielectriclayer 135. Each of the tunnel barrier patterns 140 may be interposedbetween the first magnetic pattern 120 and a corresponding one of thesecond magnetic patterns 150, and may extend along the second directionD2 between the corresponding second magnetic pattern 150 and theinterlayer dielectric layer 135. The second magnetic patterns 150 andthe tunnel barrier patterns 140 may be formed by using a singlephotomask that defines the second mask patterns M2. As a result, thesecond magnetic patterns 150 and the tunnel barrier patterns 140 mayhave the same planar shape. For example, the second magnetic patterns150 may each have a linear shape extending in the second direction D2and may be spaced apart from each other in the first direction D1. Thetunnel barrier patterns 140 may each have a linear shape extending inthe second direction D2 and may be spaced apart from each other in thefirst direction D1.

When a plurality of first magnetic patterns are disposed belowcorresponding second magnetic patterns 150, the plurality of firstmagnetic patterns may be formed by using a different photomask from thatused for forming the conductive line 110. Therefore, an increased numberof photomasks may be used to fabricate a magnetic memory device.Moreover, when the second magnetic patterns 150 are formed, an alignmentmay be performed between each of the second magnetic patterns 150 andits corresponding first magnetic pattern. Thus, a process margin maydecrease in forming the second magnetic patterns 150.

According to the present inventive concepts, the first magnetic pattern120 may be formed to extend in the first direction D1 to run across theplurality of second magnetic patterns 150. In this case, the firstmagnetic pattern 120 and the conductive line 110 may be formed by usinga single photomask that defines the first mask pattern M1. In thissense, no additional photomask may be needed to form the first magneticpattern 120. Therefore, it may be possible to reduce the number ofphotomasks used for fabricating a magnetic memory device. Furthermore,because the plurality of second magnetic patterns 150 are formed to runacross the first magnetic pattern 120, an easy alignment may beestablished between the first magnetic pattern 120 and the plurality ofsecond magnetic patterns 150. Thus, a process margin may increase informing the second magnetic patterns 150. As a result, the magneticmemory device may be easily mass-fabricated.

FIG. 11 illustrates a simplified perspective view showing a magneticmemory device according to some example embodiments of the presentinventive concepts. The following will mainly explain differences fromthe magnetic memory device discussed above with reference to FIG. 1.

Referring to FIG. 11, the conductive line 110 may have a first surface110US and a second surface 110LS opposite to each other. The firstmagnetic pattern 120 may be disposed on the first surface 110US of theconductive line 110. The plurality of second magnetic patterns 150 maybe disposed on the first magnetic pattern 120, while running across thefirst magnetic pattern 120. The plurality of second magnetic patterns150 may be spaced apart in the third direction D3 from the first surface110US of the conductive line 110, and the first magnetic pattern 120 maybe disposed between the first surface 110US of the conductive line 110and the plurality of second magnetic patterns 150. A plurality of firsttunnel barrier patterns 140 may be interposed between the first magneticpattern 120 and the plurality of second magnetic patterns 150. Theplurality of first tunnel barrier patterns 140 may be substantially thesame as the plurality of tunnel barrier patterns 140 discussed abovewith reference to FIG. 1.

In some embodiments, a third magnetic pattern 122 may be disposed on thesecond surface 110LS of the conductive line 110. The conductive line 110may be placed between the first magnetic pattern 120 and the thirdmagnetic pattern 122. The first magnetic pattern 120 and the thirdmagnetic pattern 122 may be spaced apart in the third direction D3 fromeach other across the conductive line 110, and may extend parallel tothe conductive line 110 along the first direction D1. The first magneticpattern 120, the conductive line 110, and the third magnetic pattern 122may run across the plurality of second magnetic patterns 150.

A plurality of fourth magnetic patterns 152 may be disposed on the thirdmagnetic pattern 122, while running across the third magnetic pattern122. The plurality of fourth magnetic patterns 152 may extend in thesecond direction D2 and may be spaced apart from each other along thefirst direction D1. The plurality of fourth magnetic patterns 152 may bespaced apart from the second surface 110LS of the conductive line 110along a direction opposite to the third direction D3. The third magneticpattern 122 may be disposed between the second surface 110LS of theconductive line 110 and the plurality of fourth magnetic patterns 152.The first magnetic pattern 120, the conductive line 110, and the thirdmagnetic pattern 122 may run across the plurality of fourth magneticpatterns 152.

A plurality of second tunnel barrier patterns 142 may be interposedbetween the third magnetic pattern 122 and the plurality of fourthmagnetic patterns 152. The plurality of second tunnel barrier patterns142 may extend in the second direction D2 and may be spaced apart fromeach other along the first direction D1. Each of the plurality of secondtunnel barrier patterns 142 may be interposed between the third magneticpattern 122 and a corresponding one of the plurality of fourth magneticpatterns 152.

FIG. 12 illustrates a plan view showing a magnetic memory deviceaccording to some example embodiments of the present inventive concepts.FIG. 13A illustrates a cross-sectional view taken along line A-A′ ofFIG. 12. FIG. 13B illustrates a cross-sectional view taken along lineB-B′ of FIG. 12. The following will mainly describe differences from themagnetic memory device discussed above with reference to FIGS. 2, 3A,and 3B.

Referring to FIGS. 12, 13A, and 13B, the substrate 100 may be providedthereon with the conductive line 110 that extends in the first directionD1 parallel to the top surface 100U of the substrate 100. The conductiveline 110 may have a first surface 110US and a second surface 110LSopposite to each other. The second surface 110LS may be closer than thefirst surface 110US to the substrate 100. The first and second surfaces110US and 110LS of the conductive line 110 may be parallel to the topsurface 100U of the substrate 100. The first magnetic pattern 120 may bedisposed on the first surface 110US of the conductive line 110, whileextending in the first direction D1.

In some embodiments, a third magnetic pattern 122 may be disposed on thesecond surface 110LS of the conductive line 110, while extending in thefirst direction D1. The third magnetic pattern 122 may be disposedbetween the substrate 100 and the conductive line 110. The conductiveline 110 may be placed between the first magnetic pattern 120 and thethird magnetic pattern 122. The first magnetic pattern 120 and the thirdmagnetic pattern 122 may be spaced apart from each other across theconductive line 110 in a direction perpendicular to the top surface 100Uof the substrate 100, and may extend parallel to the conductive line 110along the first direction D1. The first magnetic pattern 120 and thethird magnetic pattern 122 may vertically overlap the conductive line110 along the third direction D3. The third magnetic pattern 122 mayinclude substantially the same material as that of the first magneticpattern 120.

The substrate 100 may be provided thereon with an upper interlayerdielectric layer 135 that covers the conductive line 110 and the firstand third magnetic patterns 120 and 122. The upper interlayer dielectriclayer 135 may be substantially the same as the interlayer dielectriclayer 135 discussed above with reference to FIGS. 2, 3A, and 3B. Theupper interlayer dielectric layer 135 may cover a lateral surface ofeach of the conductive line 110, the first magnetic pattern 120, and thethird magnetic pattern 122. The first magnetic pattern 120 may have atop surface substantially coplanar with that of the upper interlayerdielectric layer 135, and the third magnetic pattern 122 may have abottom surface substantially coplanar with that of the upper interlayerdielectric layer 135.

The upper interlayer dielectric layer 135 may be provided thereon withthe plurality of second magnetic patterns 150 that run across the firstmagnetic pattern 120. The plurality of second magnetic patterns 150 maybe spaced apart in the third direction D3 from the first surface 110USof the conductive line 110, and the first magnetic pattern 120 may bedisposed between the first surface 110US of the conductive line 110 andthe plurality of second magnetic patterns 150. The first magneticpattern 120, the conductive line 110, and the third magnetic pattern 122may run across the plurality of second magnetic patterns 150.

A plurality of first tunnel barrier patterns 140 may be interposedbetween the first magnetic pattern 120 and the plurality of secondmagnetic patterns 150. The plurality of first tunnel barrier patterns140 may be substantially the same as the tunnel barrier patterns 140discussed above with reference to FIGS. 2, 3A, and 3B. Each of theplurality of first tunnel barrier patterns 140 may be interposed betweenthe first magnetic pattern 120 and a corresponding one of the pluralityof second magnetic patterns 150, and may extend between thecorresponding second magnetic pattern 150 and the upper interlayerdielectric layer 135.

A plurality of fourth magnetic patterns 152 may be disposed between thesubstrate 100 and the third magnetic pattern 122. The plurality offourth magnetic patterns 152 may run across the third magnetic pattern122. The plurality of fourth magnetic patterns 152 may extend in thesecond direction D2 and may be spaced apart from each other along thefirst direction D1. The plurality of fourth magnetic patterns 152 may bespaced apart from the second surface 110LS of the conductive line 110along a direction opposite to the third direction D3, and may bedisposed between the second surface 110LS of the conductive line 110 andthe substrate 100. The first magnetic pattern 120, the conductive line110, and the third magnetic pattern 122 may run across the plurality offourth magnetic patterns 152. Each of the plurality of fourth magneticpatterns 152 may include a plurality of magnetic domains D and aplurality of magnetic domain walls DW. In each of the plurality offourth magnetic patterns 152, the plurality of magnetic domains D andthe plurality of magnetic domain walls DW may be arranged alternatelyand repeatedly along the second direction D2. The plurality of fourthmagnetic patterns 152 may include substantially the same material asthat of the plurality of second magnetic patterns 150.

A plurality of second tunnel barrier patterns 142 may be interposedbetween the third magnetic pattern 122 and the plurality of fourthmagnetic patterns 152. The plurality of second tunnel barrier patterns142 may extend in the second direction D2 and may be spaced apart fromeach other along the first direction D1. Each of the plurality of secondtunnel barrier patterns 142 may be interposed between the third magneticpattern 122 and a corresponding one of the plurality of fourth magneticpatterns 152, and may extend between the corresponding fourth magneticpattern 152 and the upper interlayer dielectric layer 135. The pluralityof second tunnel barrier patterns 142 may include substantially the samematerial as that of the plurality of first tunnel barrier patterns 140.

The substrate 100 and the upper interlayer dielectric layer 135 may havetherebetween a lower interlayer dielectric layer 133 that coverssidewalls of the plurality of fourth magnetic patterns 152 and theplurality of second tunnel barrier patterns 142. The lower interlayerdielectric layer 133 may include, for example, one or more of siliconoxide, silicon nitride, and silicon oxynitride.

Each of the first and third magnetic patterns 120 and 122 may be areference layer whose magnetization direction is fixed in one direction.Each of the second and fourth magnetic patterns 150 and 152 may be afree layer whose magnetization direction is switchable. In each of thesecond magnetic patterns 150, each of the magnetic domains D may have amagnetization direction capable of being oriented parallel orantiparallel to the magnetization direction of the first magneticpattern 120. In each of the fourth magnetic patterns 152, each of themagnetic domains D may have a magnetization direction capable of beingoriented parallel or antiparallel to the magnetization direction of thethird magnetic pattern 122. For example, likewise to that discussedabove with reference to FIG. 3C, the magnetization directions of thefirst and third magnetic patterns 120 and 122 and the magnetizationdirection of each of the magnetic domains D in the second and fourthmagnetic patterns 150 and 152 may be perpendicular to an interfacebetween the first magnetic pattern 120 and each of first tunnel barrierpatterns 140 and also to an interface between the third magnetic pattern122 and each of the second tunnel barrier patterns 142. For anotherexample, likewise to that discussed above with reference to FIG. 3D, themagnetization directions of the first and third magnetic patterns 120and 122 and the magnetization direction of each of the magnetic domainsD in the second and fourth magnetic patterns 150 and 152 may be parallelto an interface between the first magnetic pattern 120 and each of firsttunnel barrier patterns 140 and also to an interface between the thirdmagnetic pattern 122 and each of the second tunnel barrier patterns 142.

The first magnetic pattern 120 may extend in the first direction D1 andbe connected in common to the plurality of second magnetic patterns 150,and the third magnetic pattern 122 may extend in the first direction D1and be connected in common to the plurality of fourth magnetic patterns152. The first magnetic pattern 120 may extend from a first locationbetween the conductive line 110 and one of the plurality of secondmagnetic patterns 150 toward (and/or to) a second location between theconductive line 110 and another of the plurality of second magneticpatterns 150. The third magnetic pattern 122 may extend from a thirdlocation between the conductive line 110 and one of the plurality offourth magnetic patterns 152 toward (and/or to) a fourth locationbetween the conductive line 110 and another of the plurality of fourthmagnetic patterns 152.

FIGS. 14A and 14B illustrate conceptual views showing a read operationof a magnetic memory device according to some example embodiments of thepresent inventive concepts. FIG. 14A illustrates a cross-sectional viewtaken along line A-A′ of FIG. 12. FIG. 14B illustrates a cross-sectionalview taken along line B-B′ of FIG. 12. The following will mainlydescribe differences from the read operation of the magnetic memorydevice discussed above with reference to FIGS. 4A, 4B, 5A, and 5B.

Referring to FIGS. 2, 14A, and 14B, a first current I1 to move themagnetic domain walls DW may flow through one of the plurality of secondmagnetic patterns 150. The rest of the plurality of second magneticpatterns 150 may be held in an electrical floating state F. For example,in the one of the plurality of second magnetic patterns 150, the firstcurrent I1 may flow in the second direction D2, and the magnetic domainwalls DW may move in a direction (e.g., a moving direction of electronsE) opposite to the second direction D2. In the one of the plurality ofsecond magnetic patterns 150, the magnetization direction 150MD of eachof the magnetic domains D may be parallel or antiparallel to themagnetization direction 120MD of the first magnetic pattern 120. Whenthe first current I1 flows through the one of the plurality of secondmagnetic patterns 150, the motion of the magnetic domain walls DW mayallow the first magnetic domain Da to align with the first magneticpattern 120. The first magnetic pattern 120 and the first magneticdomain Da may constitute the first magnetic tunnel junction MTJ1.

A second current 12 to move the magnetic domain walls DW may flowthrough one of the plurality of fourth magnetic patterns 152. The restof the plurality of fourth magnetic patterns 152 may be held in anelectrical floating state F. For example, in the one of the plurality offourth magnetic patterns 152, the second current 12 may flow in thesecond direction D2, and the magnetic domain walls DW may move in adirection (e.g., a moving direction of electrons E) opposite to thesecond direction D2. In the one of the plurality of fourth magneticpatterns 152, a magnetization direction 152MD of each of the magneticdomains D may be parallel or antiparallel to a magnetization direction122MD of the third magnetic pattern 122. When the second current 12flows through the one of the plurality of fourth magnetic patterns 152,the motion of the magnetic domain walls DW may allow a third magneticdomain Dc to align with the third magnetic pattern 122. The thirdmagnetic pattern 122 and the third magnetic domain Dc may constitute athird magnetic tunnel junction MTJ3.

A first read current Iread1 may flow through the first magnetic tunneljunction MTJ1, and a second read current Iread2 may flow through thethird magnetic tunnel junction MTJ3. The first read current Iread1 andthe second read current Iread2 may be provided simultaneously orsequentially. The first read current Iread1 may flow from the firstmagnetic pattern 120 toward the first magnetic domain Da along adirection (e.g., the third direction D3) perpendicular to an interfacebetween the first magnetic pattern 120 and a corresponding one of theplurality of first tunnel barrier patterns 140. The first read currentIread1 may detect a resistance state of the first magnetic tunneljunction MTJ1. For example, the magnetization direction 150MD of thefirst magnetic domain Da may be parallel to the magnetization direction120MD of the first magnetic pattern 120 and, in this case, the firstmagnetic tunnel junction MTJ1 may be held in a low-resistance state. Adata (e.g., a logic state of 0 or 1) stored in the first magnetic domainDa may be detected from the resistance state of the first magnetictunnel junction MTJ1. The second read current Iread2 may flow from thethird magnetic pattern 122 toward the third magnetic domain Dc along adirection (e.g., a direction opposite to the third direction D3)perpendicular to an interface between the third magnetic pattern 122 anda corresponding one of the plurality of second tunnel barrier patterns142. The second read current Iread2 may detect a resistance state of thethird magnetic tunnel junction MTJ3. For example, the magnetizationdirection 152MD of the third magnetic domain Dc may be antiparallel tothe magnetization direction 122MD of the third magnetic pattern 122 and,in this case, the third magnetic tunnel junction MTJ3 may be held in ahigh-resistance state. A data (e.g., a logic state of 1 or 0) stored inthe third magnetic domain Dc may be detected from the resistance stateof the third magnetic tunnel junction MTJ3.

According to some embodiments of the present inventive concepts, thefirst magnetic pattern 120 may run across the plurality of secondmagnetic patterns 150 and also may be connected in common to theplurality of second magnetic patterns 150. Moreover, the third magneticpattern 122 may run across the plurality of fourth magnetic patterns 152and also may be connected in common to the plurality of fourth magneticpatterns 152. In this case, the first magnetic pattern 120 and the thirdmagnetic pattern 122 may be used to simultaneously perform readoperations on one of the plurality of second magnetic patterns 150 andone of the plurality of fourth magnetic patterns 152.

FIGS. 15A and 15B illustrate conceptual views showing a write operationof a magnetic memory device according to some example embodiments of thepresent inventive concepts. FIG. 15A illustrates a cross-sectional viewtaken along line A-A′ of FIG. 12. FIG. 15B illustrates a cross-sectionalview taken along line B-B′ of FIG. 12. The following will mainlydescribe differences from the write operation of the magnetic memorydevice discussed above with reference to FIGS. 6A, 6B, 7A, and 7B.

Referring to FIGS. 2, 15A, and 15B, the first current I1 to move themagnetic domain walls DW may flow through one of the plurality of secondmagnetic patterns 150. The rest of the plurality of second magneticpatterns 150 may be held in an electrical floating state F. When thefirst current I1 flows through the one of the plurality of secondmagnetic patterns 150, the motion of the magnetic domain walls DW mayallow the first magnetic domain Da to align with the first magneticpattern 120. The first magnetic pattern 120 and the first magneticdomain Da may constitute the first magnetic tunnel junction MTJ1. Forexample, the magnetization direction 150MD of the first magnetic domainDa may be parallel to the magnetization direction 120MD of the firstmagnetic pattern 120. The second current 12 to move the magnetic domainwalls DW may flow through one of the plurality of fourth magneticpatterns 152. The rest of the plurality of fourth magnetic patterns 152may be held in an electrical floating state F. When the second current12 flows through the one of the plurality of fourth magnetic patterns152, the motion of the magnetic domain walls DW may allow the thirdmagnetic domain Dc to align with the third magnetic pattern 122. Thethird magnetic pattern 122 and the third magnetic domain Dc mayconstitute the third magnetic tunnel junction MTJ3. For example, themagnetization direction 152MD of the third magnetic domain Dc may beantiparallel to the magnetization direction 122MD of the third magneticpattern 122.

A first write current Isw1 may flow through the first magnetic tunneljunction MTJ1, and a second write current Isw2 may flow through thethird magnetic tunnel junction MTJ3. The first write current Isw1 andthe second write current Isw2 may be provided simultaneously orsequentially. Each of the first and second write currents Isw1 and Isw2may have a magnitude greater than that of the first read current Iread1and that of the second read current Iread2. The first write current Isw1may flow from the first magnetic pattern 120 toward the first magneticdomain Da along a direction (e.g., the third direction D3) perpendicularto an interface between the first magnetic pattern 120 and acorresponding one of the plurality of first tunnel barrier patterns 140.The magnetization direction 150MD of the first magnetic domain Da may bereversed by spin transfer torque caused by the first write current Isw1.For example, owing to the spin transfer torque caused by the first writecurrent Isw1, the magnetization direction 150MD of the first magneticdomain Da may be switched antiparallel to the magnetization direction120MD of the first magnetic pattern 120. The second write current Isw2may flow from the third magnetic domain Dc toward the third magneticpattern 122 along a direction (e.g., the third direction D3)perpendicular to an interface between the third magnetic pattern 122 anda corresponding one of the plurality of second tunnel barrier patterns142. The magnetization direction 152MD of the third magnetic domain Dcmay be reversed by spin transfer torque caused by the second writecurrent Isw2. For example, owing to the spin transfer torque caused bythe second write current Isw2, the magnetization direction 152MD of thethird magnetic domain Dc may be switched parallel to the magnetizationdirection 122MD of the third magnetic pattern 122.

According to some embodiments of the present inventive concepts, thefirst magnetic pattern 120 may run across the plurality of secondmagnetic patterns 150 and also may be connected in common to theplurality of second magnetic patterns 150. Moreover, the third magneticpattern 122 may run across the plurality of fourth magnetic patterns 152and also may be connected in common to the plurality of fourth magneticpatterns 152. In this case, the first magnetic pattern 120 and the thirdmagnetic pattern 122 may be used to simultaneously perform writeoperations on one of the plurality of second magnetic patterns 150 andone of the plurality of fourth magnetic patterns 152.

FIGS. 16A to 18B illustrate cross-sectional views showing a method offabricating a magnetic memory device according to some exampleembodiments of the present inventive concepts. FIGS. 16A, 17A, and 18Aillustrate cross-sectional views taken along line A-A′ of FIG. 12. FIG.16B, 17B, and 18B illustrate cross-sectional views taken along line B-B′of FIG. 12. For brevity of description, the following will mainlyexplain differences from the method of fabricating the magnetic memorydevice discussed above with reference to FIGS. 8A to 10B.

Referring to FIGS. 2, 16A, and 16B, a fourth magnetic layer 152L and asecond tunnel barrier layer 142L may be sequentially formed on thesubstrate 100. The fourth magnetic layer 152L may be formed between thesubstrate 100 and the second tunnel barrier layer 142L. The fourthmagnetic layer 152L and the second tunnel barrier layer 142L may beformed by using chemical vapor deposition or physical vapor deposition(e.g., sputtering deposition). The fourth magnetic layer 152L mayinclude a plurality of magnetic domains D and a plurality of magneticdomain walls DW.

Third mask patterns M3 may be formed on the second tunnel barrier layer142L. Each of the third mask patterns M3 may have a linear shapeextending in the second direction D2. The third mask patterns M3 may bespaced apart from each other along the first direction D1. The thirdmask patterns M3 may include a material having an etch selectivity withrespect to the second tunnel barrier layer 142L and the fourth magneticlayer 152L.

Referring to FIGS. 2, 17A, and 17B, a third etching process may beperformed in which the third mask patterns M3 are used as an etchingmask to etch the fourth magnetic layer 152L and the second tunnelbarrier layer 142L. The third etching process may be performed such thatthe fourth magnetic layer 152L and the second tunnel barrier layer 142Lmay be sequentially etched to form fourth magnetic patterns 152 andsecond tunnel barrier patterns 142. The fourth magnetic patterns 152 andthe second tunnel barrier patterns 142 may be formed by using a singlephotomask that defines the third mask patterns M3, as a result, thefourth magnetic patterns 152 and the second tunnel barrier patterns 142may have the same planar shape. For example, the fourth magneticpatterns 152 may each have a linear shape extending in the seconddirection D2 and may be spaced apart from each other in the firstdirection D1. The second tunnel barrier patterns 142 may each have alinear shape extending in the second direction D2 and may be spacedapart from each other in the first direction D1.

A lower interlayer dielectric layer 133 may be formed on the substrate100, thereby covering sidewalls of the fourth magnetic patterns 152 andthe second tunnel barrier patterns 142. The formation of the lowerinterlayer dielectric layer 133 may include, for example, forming on thesubstrate 100 a dielectric layer that covers the fourth magneticpatterns 152 and the second tunnel barrier patterns 142, and performingon the dielectric layer a planarization process to expose top surfacesof the second tunnel barrier patterns 142. In some embodiments, thethird mask patterns M3 may be removed during the planarization process.

A third magnetic layer 122L may be formed on the lower interlayerdielectric layer 133, thereby covering the top surfaces of the secondtunnel barrier patterns 142. The third magnetic layer 122L be formed byusing chemical vapor deposition or physical vapor deposition (e.g.,sputtering deposition).

A conductive layer 110L and a first magnetic layer 120L may besequentially formed on the third magnetic layer 122L. The conductivelayer 110L may be interposed between the third magnetic layer 122L andthe first magnetic layer 120L. A first mask pattern M1 may be formed onthe first magnetic layer 120L. The first mask pattern M1 may have alinear shape extending in the first direction D1. The conductive layer110L, the first magnetic layer 120L, and the first mask pattern M1 maybe formed by substantially the same method as that discussed above withreference to FIGS. 8A and 8B.

Referring to FIGS. 2, 18A, and 18B, a first etching process may beperformed in which the first mask pattern M1 is used as an etching maskto etch the first magnetic layer 120L, the conductive layer 110L, andthe third magnetic layer 122L. The first etching process may beperformed such that the first magnetic layer 120L, the conductive layer110L, and the third magnetic layer 122L may be sequentially etched toform a first magnetic pattern 120, a conductive line 110, and a thirdmagnetic pattern 122. The first magnetic pattern 120, the conductiveline 110, and the third magnetic pattern 122 may be formed by using asingle photomask that defines the first mask pattern M1. As a result,the first magnetic pattern 120, the conductive line 110, and the thirdmagnetic pattern 122 may have substantially the same planar shape. Forexample, the first magnetic pattern 120, the conductive line 110, andthe third magnetic pattern 122 may each have a linear shape extending inthe first direction D1.

An upper interlayer dielectric layer 135 may be formed on the lowerinterlayer dielectric layer 133, thereby covering sidewalls of the firstmagnetic pattern 120, the conductive line 110, and the third magneticpattern 122. The formation of the upper interlayer dielectric layer 135may include, for example, forming on the lower interlayer dielectriclayer 133 a dielectric layer that covers the first magnetic pattern 120,the conductive line 110, and the third magnetic pattern 122, andperforming on the dielectric layer a planarization process to expose atop surface of the first magnetic pattern 120. In some embodiments, thefirst mask pattern M1 may be removed during the planarization process.

A first tunnel barrier layer 140L and a second magnetic layer 150L maybe sequentially formed on the upper interlayer dielectric layer 135,thereby covering the top surface of the first magnetic pattern 120. Thesecond magnetic layer 150L may include a plurality of magnetic domains Dand a plurality of magnetic domain walls DW. Second mask patterns M2 maybe formed on the second magnetic layer 150L. The first tunnel barrierlayer 140L, the second magnetic layer 150L, and the second mask patternsM2 may be formed by substantially the same method as that discussedabove with reference to FIGS. 10A and 10B.

Referring back to FIGS. 12, 13A, and 13B, a second etching process maybe performed in which the second mask patterns M2 are used as an etchingmask to etch the second magnetic layer 150L and the first tunnel barrierlayer 140L. The second etching process may be performed such that thesecond magnetic layer 150L and the first tunnel barrier layer 140L maybe sequentially etched to form second magnetic patterns 150 and firsttunnel barrier patterns 140. The second magnetic patterns 150 and thefirst tunnel barrier patterns 140 may be formed by using a singlephotomask that defines the second mask patterns M2. As a result, thesecond magnetic patterns 150 and the first tunnel barrier patterns 140may have the same planar shape. For example, the second magneticpatterns 150 may each have a linear shape extending in the seconddirection D2 and may be spaced apart from each other in the firstdirection D1. The first tunnel barrier patterns 140 may each have alinear shape extending in the second direction D2 and may be spacedapart from each other in the first direction D1.

According to the present inventive concepts, the first magnetic pattern120, the conductive line 110, and the third magnetic pattern 122 may beformed by using a single photomask that defines the first mask patternM1. Therefore, it may be possible to reduce the number of photomasksused for fabricating a magnetic memory device. Moreover, because thefirst magnetic pattern 120, the conductive line 110, and the thirdmagnetic pattern 122 are formed to run across the plurality of secondmagnetic patterns 150 and the plurality of fourth magnetic patterns 152,the magnetic memory device may be easy to achieve high integration.

FIG. 19 illustrates a simplified perspective view showing a magneticmemory device according to some example embodiments of the presentinventive concepts. The following will mainly explain differences fromthe magnetic memory device discussed above with reference to FIG. 11.

Referring to FIG. 19, the conductive line 110, the first magneticpattern 120, and the third magnetic pattern 122 may constitute aread/write structure 130. In some embodiments, the read/write structure130 may be provided in plural. The plurality of read/write structures130 may be disposed between the plurality of second magnetic patterns150 and the plurality of fourth magnetic patterns 152, and may be spacedapart from each other in the second direction D2. The plurality ofsecond magnetic patterns 150 and the plurality of fourth magneticpatterns 152 may be connected in common to the plurality of read/writestructures 130. The plurality of read/write structures 130 may runacross the plurality of second magnetic patterns 150, and the firstmagnetic pattern 120 of each of the plurality of read/write structures130 may be connected in common to the plurality of second magneticpatterns 150. The plurality of read/write structures 130 may run acrossthe plurality of fourth magnetic patterns 152, and the third magneticpattern 122 of each of the plurality of read/write structures 130 may beconnected in common to the plurality of fourth magnetic patterns 152.

FIG. 20 illustrates a plan view showing a magnetic memory deviceaccording to some example embodiments of the present inventive concepts.FIG. 21A illustrates a cross-sectional view taken along line A-A′ ofFIG. 20. FIG. 21B illustrates a cross-sectional view taken along lineB-B′ of FIG. 20. The following will mainly describe differences from themagnetic memory device discussed above with reference to FIGS. 12, 13A,and 13B.

Referring to FIGS. 20, 21A, and 21B, the conductive line 110, the firstmagnetic pattern 120, and the third magnetic pattern 122 may constitutea read/write structure 130, and a plurality of read/write structures 130may be disposed in the upper interlayer dielectric layer 135. Theplurality of read/write structures 130 may be spaced apart from eachother in the second direction D2 in the upper interlayer dielectriclayer 135. The plurality of read/write structures 130 may be located ata height (or level) between the plurality of second magnetic patterns150 and the plurality of fourth magnetic patterns 152. The plurality ofread/write structures 130 may run across the plurality of secondmagnetic patterns 150, and the first magnetic pattern 120 of each of theplurality of read/write structures 130 may be connected in common to theplurality of second magnetic patterns 150. The plurality of read/writestructures 130 may run across the plurality of fourth magnetic patterns152, and the third magnetic pattern 122 of each of the plurality ofread/write structures 130 may be connected in common to the plurality offourth magnetic patterns 152. Each of the plurality of read/writestructures 130 may be connected in common to corresponding portions ofthe plurality of second magnetic patterns 150 and also to correspondingportions of the plurality of fourth magnetic patterns 152.

FIGS. 22A and 22B illustrate conceptual views showing a read operationof a magnetic memory device according to some example embodiments of thepresent inventive concepts. FIG. 22A illustrates a cross-sectional viewtaken along line A-A′ of FIG. 20. FIG. 22B illustrates a cross-sectionalview taken along line B-B′ of FIG. 20. The following will describedifferences from the read operation of the magnetic memory devicediscussed above with reference to FIGS. 14A and 14B.

Referring to FIGS. 20, 22A, and 22B, a current Ito move the magneticdomain walls DW may flow through one of the plurality of second magneticpatterns 150. The rest of the plurality of second magnetic patterns 150and the plurality of fourth magnetic patterns 152 may be held in anelectrical floating state F. For example, in the one of the plurality ofsecond magnetic patterns 150, the current I may flow in the seconddirection D2, and the magnetic domain walls DW may move in a direction(e.g., a moving direction of electrons E) opposite to the seconddirection D2. When the current I flows through the one of the pluralityof second magnetic patterns 150, the motion of the magnetic domain wallsDW may allow corresponding magnetic domains D to align with theplurality of read/write structures 130. The first magnetic patterns 120of the plurality of read/write structures 130 and the correspondingmagnetic domains D may constitute magnetic tunnel junctions MTJ.

A read current Iread may flow through the plurality of read/writestructures 130. The read current Iread may be provided simultaneously orsequentially. The read current Iread may detect resistance states of themagnetic tunnel junctions MTJ. A data (e.g., a logic state of 1 or 0)stored in the corresponding magnetic domains D may be detected from theresistance states of the magnetic tunnel junctions MTJ. In someembodiments of the present inventive concepts, the read operation may besequentially and individually performed on the plurality of secondmagnetic patterns 150 and the plurality of fourth magnetic patterns 152.Moreover, in one of the second and fourth magnetic patterns 150 and 152,the plurality of read/write structures 130 may be used to simultaneouslyperform read operations on different magnetic domains D.

FIGS. 23A and 23B illustrate conceptual views showing a write operationof a magnetic memory device according to some example embodiments of thepresent inventive concepts. FIG. 23A illustrates a cross-sectional viewtaken along line A-A′ of FIG. 20. FIG. 23B illustrates a cross-sectionalview taken along line B-B′ of FIG. 20. The following will describedifferences from the write operation of the magnetic memory devicediscussed above with reference to FIGS. 15A and 15B.

Referring to FIGS. 20, 23A, and 23B, the current Ito move the magneticdomain walls DW may flow through one of the plurality of second magneticpatterns 150. The rest of the plurality of second magnetic patterns 150and the plurality of fourth magnetic patterns 152 may be held in anelectrical floating state F. When the current I flows through the one ofthe plurality of second magnetic patterns 150, the motion of themagnetic domain walls DW may allow corresponding magnetic domains D toalign with the plurality of read/write structures 130. The firstmagnetic patterns 120 of the plurality of read/write structures 130 andthe corresponding magnetic domains D may constitute magnetic tunneljunctions MTJ.

A write current Isw may flow through the plurality of read/writestructures 130. The write current Isw may be provided simultaneously orsequentially. The write current Isw may have a magnitude greater thanthat of the read current Tread. A spin transfer torque caused by thewrite current Isw may reverse the magnetization directions 150MD of thecorresponding magnetic domains D in the magnetization tunnel junctionsMTJ. Owing to the spin transfer torque caused by the write current Isw,the magnetization direction 150MD of each of the corresponding magneticdomains D may be switched parallel or antiparallel to the magnetizationdirection 120MD of the first magnetic pattern 120. In some embodimentsof the present inventive concepts, the write operation may besequentially and individually performed on the plurality of secondmagnetic patterns 150 and the plurality of fourth magnetic patterns 152.Moreover, in one of the second and fourth magnetic patterns 150 and 152,the plurality of read/write structures 130 may be used to simultaneouslyperform read operations on different magnetic domains D.

According to the present inventive concepts, a first magnetic patternmay run across a plurality of second magnetic patterns and also may beconnected in common to the plurality of second magnetic patterns. Inthis case, the first magnetic pattern and its underlying conductive linemay be formed by using a single photomask, and no additional photomaskmay be required to form the first magnetic pattern. Therefore, it may bepossible to reduce the number of photomasks used for fabricating amagnetic memory device. Furthermore, because the plurality of secondmagnetic patterns are formed to run across the first magnetic pattern,an easy alignment may be established between the first magnetic patternand the plurality of second magnetic patterns. Thus, a process marginmay decrease in forming the second magnetic patterns. As a result, themagnetic memory device may be easily mass-fabricated and highlyintegrated.

The aforementioned description provides some example embodiments forexplaining the present inventive concepts. Therefore, the presentinventive concepts are not limited to the embodiments described above,and it will be understood by one of ordinary skill in the art thatvariations in form and detail may be made therein without departing fromthe scope of the present inventive concepts.

1. A magnetic memory device comprising: a first magnetic pattern thatextends in a first direction and has a magnetization direction fixed inone direction; and a plurality of second magnetic patterns that extendacross the first magnetic pattern, wherein the plurality of secondmagnetic patterns extend in a second direction intersecting the firstdirection and are spaced apart from each other in the first direction,and wherein each of the plurality of second magnetic patterns includes aplurality of magnetic domains that are spaced apart from each other inthe second direction.
 2. The magnetic memory device of claim 1, whereinthe first magnetic pattern is electrically connected to each of theplurality of second magnetic patterns.
 3. The magnetic memory device ofclaim 2, further comprising a plurality of tunnel barrier patterns thatextend across the first magnetic pattern, wherein each of the pluralityof tunnel barrier patterns is between the first magnetic pattern and arespective one of the plurality of second magnetic patterns.
 4. Themagnetic memory device of claim 3, wherein the plurality of tunnelbarrier patterns extend in the second direction and are spaced apartfrom each other in the first direction.
 5. The magnetic memory device ofclaim 2, further comprising a conductive line that extends in the firstdirection and is electrically connected to the first magnetic pattern,wherein the first magnetic pattern is between the conductive line andthe plurality of second magnetic patterns.
 6. (canceled)
 7. The magneticmemory device of claim 5, further comprising a third magnetic patternthat extends in the first direction and has a magnetization directionfixed in one direction, wherein the conductive line is between the firstmagnetic pattern and the third magnetic pattern.
 8. The magnetic memorydevice of claim 7, wherein the first magnetic pattern, the conductiveline, and the third magnetic pattern overlap each other along a thirddirection intersecting the first and second directions.
 9. The magneticmemory device of claim 7, further comprising a plurality of fourthmagnetic patterns that extend across the third magnetic pattern, whereinthe third magnetic pattern is between the conductive line and theplurality of fourth magnetic patterns.
 10. The magnetic memory device ofclaim 9, wherein the third magnetic pattern is electrically connected toeach of the plurality of fourth magnetic patterns.
 11. (canceled) 12.The magnetic memory device of claim 1, further comprising a tunnelbarrier pattern between the first magnetic pattern and one of theplurality of second magnetic patterns, wherein the magnetizationdirection of the first magnetic pattern and a magnetization direction ofeach of the magnetic domains are perpendicular to an interface betweenthe tunnel barrier pattern and the first magnetic pattern.
 13. Themagnetic memory device of claim 1, further comprising a tunnel barrierpattern between the first magnetic pattern and one of the plurality ofsecond magnetic patterns, wherein the magnetization direction of thefirst magnetic pattern and a magnetization direction of each of themagnetic domains are parallel to an interface between the tunnel barrierpattern and the first magnetic pattern.
 14. A magnetic memory devicecomprising: a conductive line that extends in a first direction on asubstrate; a first magnetic pattern that is on the conductive line andextends in the first direction; and a plurality of second magneticpatterns that are on the first magnetic pattern and extend across thefirst magnetic pattern, wherein the plurality of second magneticpatterns extend in a second direction intersecting the first directionand are spaced apart from each other in the first direction, and whereineach of the plurality of second magnetic patterns includes a pluralityof magnetic domains that are spaced apart from each other in the seconddirection.
 15. (canceled)
 16. (canceled)
 17. The magnetic memory deviceof claim 14, wherein the first magnetic pattern extends from a firstlocation between the conductive line and one of the plurality of secondmagnetic patterns to a second location between the conductive line andanother of the plurality of second magnetic patterns.
 18. The magneticmemory device of claim 14, further comprising a plurality of tunnelbarrier patterns that are on the first magnetic pattern and extendacross the first magnetic pattern, wherein the plurality of tunnelbarrier patterns extend in the second direction and are spaced apartfrom each other in the first direction, and wherein each of theplurality of tunnel barrier patterns is between the first magneticpattern and a respective one of the plurality of second magneticpatterns.
 19. The magnetic memory device of claim 18, further comprisingan interlayer dielectric layer on the substrate and on a lateral surfaceof the conductive line and a lateral surface of the first magneticpattern, wherein the plurality of second magnetic patterns and theplurality of tunnel barrier patterns are on the interlayer dielectriclayer.
 20. The magnetic memory device of claim 14, wherein the firstmagnetic pattern has a magnetization direction fixed in one direction,and wherein each of the magnetic domains has a magnetization directionthat is switchable between being oriented parallel or antiparallel tothe magnetization direction of the first magnetic pattern.
 21. Amagnetic memory device comprising: a first magnetic pattern; and aplurality of second magnetic patterns that extend across the firstmagnetic pattern, wherein each of the plurality of second magneticpatterns includes a plurality of magnetic domains that are spaced apartfrom each other, and wherein the first magnetic pattern is electricallyconnected to each of the plurality of second magnetic patterns.
 22. Themagnetic memory device of claim 21, wherein the first magnetic patternextends in a first direction, and wherein the plurality of secondmagnetic patterns extend in a second direction intersecting the firstdirection and are spaced apart from each other in the first direction.23. The magnetic memory device of claim 22, wherein the plurality ofmagnetic domains are spaced apart from each other in the seconddirection in each of the plurality of second magnetic patterns, whereinone of the plurality of magnetic domains in a first of the plurality ofsecond magnetic patterns overlaps the first magnetic pattern in a thirddirection intersecting the first and second directions, wherein one ofthe plurality of magnetic domains in a second of the plurality of secondmagnetic patterns overlaps the first magnetic pattern in the thirddirection, and wherein one of the plurality of magnetic domains in athird of the plurality of second magnetic patterns overlaps the firstmagnetic pattern in the third direction.
 24. The magnetic memory deviceof claim 21, further comprising a conductive line that is verticallyoverlapped by the first magnetic pattern, wherein the first magneticpattern is between the conductive line and the plurality of secondmagnetic patterns, and wherein the first magnetic pattern and theconductive line extend across the plurality of second magnetic patterns.25. (canceled)